[Photos/Images] New Key Visual and Ticket Information Revealed for Major Event "SPY x FAMILY ANIME EXTRA MISSION II" 1st
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From the TV anime "SPY x FAMILY," a newly drawn key visual for the special event "ANIME EXTRA MISSION II" has been unveiled. Along with this, performance details, ticket information, and attendee gift information have also been released.

The original "SPY x FAMILY" is a manga series by Tatsuya Endo, currently serialized in Shueisha's manga app "Shonen Jump+" since March 2019. The total cumulative circulation of the series up to the latest 17th volume has surpassed 42 million copies. TV Anime Season 2 began broadcasting in October 2023, and the film "SPY x FAMILY CODE: White," released in December of the same year, recorded a box office revenue of 6.32 billion yen as of August 25, 2025. Furthermore, TV Anime Season 3 aired in October 2025, bringing even more excitement to the franchise.

The newly unveiled visual features a design where the characters wear matching outfits incorporating plaid patterns. The costumes are tailored to each character's unique personality, such as the ruffles and lace skirts for Anya, Yor, Becky, and Fiona, and the neckties and single-point accents on the cuffs for Loid, Bond, Damian, and Yuri.

The event will be held on Sunday, November 8, 2026, at Belle Salle Takadanobaba, with a total of two performances: a daytime session and an evening session. Eight main cast members—Takuya Eguchi, Atsumi Tanezaki, Saori Hayami, Kenichirō Matsuda, Kenshō Ono, Natsumi Fujiwara, Emiri Katō, and Ayane Sakura—are scheduled to appear on stage. As a universal benefit for all seats, visitors will receive the "ANIME EXTRA MISSION II Special Pamphlet," which includes interviews with the eight appearing cast members.

Ticket prices are 9,020 yen (tax included) for S seats and 7,920 yen (tax included) for A seats. The priority ticket sales application for purchasers of "Season 3 Blu-ray & DVD Vol. 2," which will be released on Wednesday, May 20, 2026, will be open from 18:00 on Wednesday, May 20 to 23:59 on Sunday, June 28. This round of applications will follow a lottery-based advance system.

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